PM8019 IC
As low as
Rs 0.00
Worldwide shipping · Cash on Delivery
Product Details
====================================================================================================
QUALCOMM PM8019 / PM8019 OVV BASEBAND RF PMIC REPAIR & REWORK GUIDE
====================================================================================================
1. PRODUCT IDENTIFICATION & HARDWARE SPECIFICATIONS:
----------------------------------------------------------------------------------------------------
- Marking Code on Silicon: PM8019 (Laser Sub-code: PM8019 OVV)
- Schematic Reference: U_PMICRF (Apple Schematic Designation)
- Silicon Manufacturer: Qualcomm Technologies, Inc.
- Package Form Factor: 94-Pin Wafer-Level Chip-Scale BGA (94-Ball WLCSP)
- Functional Role: Baseband Power Management IC (BB PMIC / Small Power IC)
- Companion Baseband Modem: Qualcomm Gobi MDM9625M LTE Modem (U_BB_RF)
- Companion RF Transceiver: Qualcomm WTR1625L Transceiver & WFR1620 Receive Diversity
- Input Operating Rails: PP_VCC_MAIN / VPH_PWR (3.7V to 4.35V DC)
- Regulated Output Domains:
* Synchronous Step-Down Buck Converters:
- VDD_CORE (Modem Digital Core Supply): ~0.95V – 1.15V Dynamic Voltage Scaling.
- VDD_MEM / LPDDR: 1.2V clean supply for baseband memory.
* Ultra-Low Noise Linear LDO Regulators:
- Precision supply for RF Transceiver analog and PLL sections (1.05V, 1.8V, 2.8V).
- Voltage supplies for SIM interface (VSIM 1.8V / 3.0V), GPS LNA, and Antenna Switch Modules (ASM).
2. COMPATIBLE SMARTPHONES & LOGIC BOARDS:
----------------------------------------------------------------------------------------------------
- Apple iOS Devices:
* iPhone 6: Models A1549, A1586, A1589
* iPhone 6 Plus: Models A1522, A1524, A1593
* iPad Air 2 / iPad mini 3 / mini 4 (Cellular / LTE editions)
- Qualcomm Android Devices:
* Samsung Galaxy Note 4 (Snapdragon LTE variants: SM-N910P, SM-N910A, SM-N910V, SM-N910F)
* Selected LTE devices from Xiaomi, Oppo, and Vivo based on Snapdragon 800 / 801 / 805 platforms.
3. TYPICAL BOARD-LEVEL FAULT SYMPTOMS:
----------------------------------------------------------------------------------------------------
- Endless "Searching..." / "No Service" on iPhone:
* Status bar displays continuous "Searching..." even without a SIM card inserted.
* Navigating to Settings -> General -> About reveals "Modem Firmware" is blank/empty.
* Dialing *#06# on phone keypad fails to pop up the IMEI number.
- iTunes Restore Error 1 / Error -1:
* During iOS restore or update in iTunes/3uTools, the progress bar stalls at ~70%–80% (baseband write phase)
and fails with Error 1 or -1 because the baseband CPU cannot communicate with PM8019.
- Full System Dead (PP_VCC_MAIN Short to Ground):
* Severe internal breakdown of PM8019's high-side power MOSFET pulls the main 4.0V battery rail
(PP_VCC_MAIN / VPH_PWR) directly to ground (0.000V in diode mode), tripping the bench power supply.
- Standby Current Leakage & High Battery Drain:
* Device discharges battery rapidly in standby with noticeable heat radiating through the baseband shield
can due to a partially damaged internal LDO regulator.
4. SYSTEMATIC MULTIMETER TESTING & DIAGNOSTICS:
----------------------------------------------------------------------------------------------------
A. Cold Testing (Diode Mode Check - Board Powered Off):
1. Place multimeter in Diode Mode. Connect RED probe to motherboard GND shield:
- Main Input VCC_MAIN Capacitor (C3203_RF / C3204_RF on iPhone 6): Normal ~380mV – 480mV.
- Modem Core Inductor L3201_RF: Normal ~240mV – 320mV. Must NOT read 0.000V.
- Transceiver Power LDO Caps: Normal ~420mV – 600mV.
- SIM Power Rail (PP_L13_PMICRF_1V8): Normal ~450mV – 550mV.
2. Short-Circuit Isolation:
- If PP_VCC_MAIN reads 0.000V, inject 3.8V DC (limited to 2.5A) with rosin vapor or a thermal camera.
If PM8019 glows white instantly, lift the IC to clear the short.
B. Live Operating Voltage Check (Hot Testing):
1. Power on handset with stabilized DC bench supply:
- Verify 4.0V PP_VCC_MAIN is reaching the input capacitors surrounding PM8019.
- Measure Baseband Core inductor (L3201_RF): Must measure stable 1.05V DC during bootup.
- Measure 1.8V VIO/LDO lines feeding the WTR1625L transceiver.
2. If input 4.0V is present but all buck inductors and LDOs output 0.0V, inspect the BB_PMU_RESET
line or replace PM8019.
5. SOLDERING, REBALLING & REWORK SPECIFICATIONS:
----------------------------------------------------------------------------------------------------
- Extreme Thermal Caution:
* On iPhone 6 / 6 Plus logic boards, PM8019 (U_PMICRF) is situated directly opposite or adjacent to the
sensitive Baseband CPU (U_BB_RF / MDM9625M). Excessive heat will bridge the solder balls under the
underfilled Baseband CPU, permanently damaging the board.
* Always use high-density thermal Kapton tape and heavy copper/aluminum heatsink coins over the Baseband CPU.
- IC Desoldering (Removal):
* Apply premium non-corrosive RMA tacky BGA flux around PM8019.
* Hot air station settings: 310°C – 320°C with 35% – 40% airflow.
* Heat in small, focused concentric circles. As soon as the solder balls liquefy, lift the IC vertically
with precision micro-tweezers. Never force or scrape.
- Pad Dressing & Cleaning:
* Remove residual lead-free solder using copper desoldering braid and an iron tip set to 290°C – 300°C.
* Clean thoroughly with 99% Isopropyl Alcohol (IPA) and verify under microscope for any lifted traces.
- Reballing Procedure:
* Use a dedicated 0.12mm iPhone 6 / 6 Plus Baseband stencil.
* Apply 183°C (Sn63/Pb37) leaded solder paste. Heat at 290°C until all 94 balls form perfect spheres.
- Installation:
* Apply a microscope-thin film of flux to motherboard pads.
* Align Pin 1 dot with the PCB corner white triangle mark. Reflow at 305°C – 315°C until the IC naturally
self-centers onto its solder pads. Allow the board to cool for 5 minutes before applying power.
====================================================================================================