PM8009 IC
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Product Details
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QUALCOMM PM8009 / PM8009 001-00 COMPANION SPMI PMIC REPAIR GUIDE
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1. PRODUCT IDENTIFICATION & SILICON SPECIFICATIONS:
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- Marking Code on Silicon: PM8009 (Suffixes: 001-00, 001, 100)
- Silicon Manufacturer: Qualcomm Technologies, Inc.
- System Role: Companion Power Management IC (Auxiliary & Camera Sub-PMIC)
- Package Form Factor: Fine-Pitch Wafer-Level Chip-Scale BGA (WLCSP)
- Bus Interface: Qualcomm SPMI (System Power Management Interface) slave node
- Primary Companion Master PMICs: Qualcomm PM8250, PM8150, PM8150B, or PM8150A
- Primary Target SoC Platforms: Snapdragon 865 / 865+ / 870 (SM8250), Snapdragon 855 / 855+ (SM8150)
- Core Regulated Output Domains:
* Camera Power Tree (Spectra 480 ISP Dedicated Rails):
- Regulates multi-channel high-current analog rails (AVDD 2.8V) for main, wide-angle, and telephoto sensors.
- Low-noise digital core supplies (DVDD 1.05V / 1.2V) and Optical Image Stabilization (OIS) power.
* Auxiliary Synchronous Step-Down Buck Regulators:
- High-efficiency auxiliary rails feeding peripheral system controllers and PCIe interface blocks.
* Secondary Precision Low-Dropout (LDO) Regulators:
- Dedicated ultra-clean, ripple-free voltages for sensory subsystems and clock distribution.
2. COMPATIBLE SMARTPHONES & LOGIC BOARDS:
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- Xiaomi / Poco:
* Xiaomi Mi 10, Mi 10 Pro, Mi 10 Ultra
* Redmi K30 Pro, Redmi K30S Ultra, Poco F2 Pro
- OnePlus:
* OnePlus 7 Pro, OnePlus 7T, OnePlus 7T Pro (SM8150)
* OnePlus 8, OnePlus 8 Pro, OnePlus 8T, OnePlus 9R (SM8250)
- Samsung (Snapdragon 865 Variants):
* Galaxy S20 5G (SM-G981U), Galaxy S20+ 5G (SM-G986U), Galaxy S20 Ultra 5G (SM-G988U)
* Galaxy S20 FE 5G (SM-G781B / SM-G781U)
- Realme / Vivo / Oppo / Meizu:
* Realme X50 Pro 5G, Vivo iQOO 3 5G, iQOO Neo 5, Oppo Find X2 / X2 Pro, Meizu 17 / 17 Pro
3. TYPICAL BOARD-LEVEL FAULT SYMPTOMS:
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- Handset Completely Dead with Stuck Boot Current (0.08A – 0.15A Draw):
* Upon pressing the power key, the DC power supply shows a steady draw around 80mA–150mA and hangs.
* The main PMIC (PM8250) boots, but fails to complete SPMI slave handshaking with PM8009, halting
the boot sequence before the processor can release PS_HOLD.
- Camera Subsystem Failure / Instant Camera App Crash:
* Phone operates normally, but launching the Camera app results in a black viewfinder, "Cannot Connect
to Camera" error, or an immediate reboot (caused by collapsed 2.8V AVDD or 1.05V DVDD lines).
- Primary VPH_PWR Line Short to Ground:
* Common after moisture ingress or drop impact. An internal high-side buck FET breakdown inside PM8009
pulls the entire 4.0V VPH_PWR rail to 0.000V ground, preventing the phone from drawing any battery current.
- High Standby Battery Drain & Motherboard Hotspot:
* Phone loses 10%–20% battery per hour when idling. Thermal imaging reveals an intense heat spot
around the PM8009 shield area due to leaky internal LDO pass transistors.
4. SYSTEMATIC MULTIMETER TESTING & DIAGNOSTICS:
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A. Cold Testing (Diode Mode Check - Board Powered Off):
1. Place digital multimeter in Diode Mode. Connect RED probe to motherboard GND shield:
- Main VPH_PWR Input Capacitors next to PM8009: Normal ~360mV – 480mV.
- Camera ISP Buck Coils: Normal ~240mV – 380mV.
- Camera AVDD 2.8V Output Capacitors: Normal ~450mV – 580mV.
- SPMI Data & Clock Lines: Normal ~480mV – 550mV (must be closely matched).
2. Short-Circuit Isolation:
- If VPH_PWR reads 0.000V, inject 3.8V DC (limited to 2.5A) with rosin vapor or a thermal camera.
If PM8009 lights up instantly, remove the IC to clear the short.
B. Live Operating Voltage Check (Hot Testing):
1. Connect DC power supply at 4.0V to battery terminals.
2. Check input filter capacitors of PM8009: Must show solid 4.0V VPH_PWR.
3. Press Power Button and test output rails during startup:
- SPMI line must hold steady 1.8V DC.
- Buck inductors around PM8009 must generate their respective voltages (~1.05V / 1.2V).
4. Launch Camera app and measure:
- Camera connector power pins should register active 2.8V AVDD and 1.05V DVDD. If absent, replace PM8009.
5. SOLDERING, REBALLING & REWORK SPECIFICATIONS:
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- Thermal Shielding:
* Protect adjacent multi-camera connector sockets, UFS storage, and the Snapdragon CPU with multi-layer
Kapton tape and aluminum heat shields. Plastic camera connectors melt easily if unprotected.
- Chip Removal:
* Apply premium no-clean BGA flux around PM8009.
* Hot air station settings: 315°C – 325°C at 40% – 50% airflow.
* Move nozzle in smooth, small circular paths. When all balls liquefy, lift the IC vertically using fine tweezers.
- Pad Preparation & Cleaning:
* Solder-wick the motherboard pads flat using copper braid and a soldering iron at 300°C.
* Clean thoroughly with 99% Isopropyl Alcohol (IPA) and verify pads under microscope.
- Reballing Procedure:
* Use a dedicated 0.12mm stencil compatible with Qualcomm PM8009 / SM8250 / SM8150.
* Apply 183°C (Sn63/Pb37) solder paste evenly. Heat gently at 290°C – 300°C until uniform spheres form.
- Re-installation:
* Apply a minimal, paper-thin layer of tacky flux to the PCB pads.
* Align Pin 1 dot with the silkscreen corner mark. Reflow at 310°C until the IC naturally self-centers.
* Let the board cool completely for 5 minutes before testing.
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