PM7250B IC
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Product Details
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QUALCOMM PM7250B / PM7250B-000 / PM7250B-200 REPAIR & DIAGNOSTIC GUIDE
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1. PRODUCT IDENTIFICATION & HARDWARE SPECIFICATIONS:
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- Part Identifier: PM7250B (Suffix variants: 000, 200, 002)
- Silicon Manufacturer: Qualcomm Technologies, Inc.
- Package Form Factor: 110-Ball Fan-Out Wafer-Level CSP (110 FOWPSP / WLCSP BGA, 3.51 x 4.40 mm)
- System Architecture: Secondary / Interface / Battery Charger PMIC (Sub-PMIC)
- Paired Master PMIC: Qualcomm PM7250 (Master System PMIC) or PM6375
- Target Chipset Platforms: Qualcomm Snapdragon 765 / 765G / 768G (SM7250), Snapdragon 695 5G (SM6375),
Snapdragon 4 Gen 1 (SM4375), Snapdragon 4 Gen 2 (SM4450)
- Functional Subsystems:
* High-Efficiency Switch-Mode Battery Charger:
- Step-down buck switching topology supporting up to 4.0A fast battery charge current.
- Qualcomm Quick Charge 3.0 / 4+, USB-PD 3.0 (PPS), and adaptive thermal throttling.
* Primary System Power Generation (VPH_PWR):
- Converts incoming USB VBUS (5V, 9V, 12V) or VBAT to generate stable 3.8V – 4.2V VPH_PWR rail.
* Display Bias & Backlight Driver:
- Dual programmable boost converters generating AMOLED bias (+5.0V, -5.0V / AVDD) or WLED driver.
* Camera Flash Driver:
- Dual-channel high-current LED flash / torch driver.
* USB Type-C & Port Logic:
- Integrated CC1 / CC2 logic, D+/D- USB charging detection, and reverse 5V OTG boost converter.
* Battery Fuel Gauge:
- Precision coulomb counter and battery temperature (BATT_THERM) sensing.
2. TARGET SMARTPHONE COMPATIBILITY (COMMON MODELS):
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- PM7250B-000 (Snapdragon 765G / 768G Series):
* OnePlus: OnePlus Nord (AC2001, AC2003)
* Google: Pixel 5, Pixel 4a 5G
* Xiaomi: Redmi K30 5G, Mi 10 Lite 5G, Xiaomi Mi 10 Youth
* Vivo: Vivo X50, Vivo X50 Pro, Vivo V20 Pro 5G, iQOO Z1x
* Oppo: Oppo Reno 4 5G, Reno 4 Pro 5G, Find X2 Neo
* Samsung: Galaxy F52 5G (SM-E5260), Galaxy A71 5G (SM-A7160 / SM-A716U), Galaxy A52 5G (variant)
* Motorola: Motorola Edge (2020), Moto G 5G Plus, Razr 5G
- PM7250B-200 (Snapdragon 695 / 4 Gen 1 / 4 Gen 2 & 4G Flagship Variants):
* Xiaomi / Redmi: Redmi 12 5G, Redmi Note 12R, Redmi Note 11 Pro 5G (Qualcomm), Poco X4 Pro 5G
* Honor: Honor X50, Honor 60
* Huawei: Nova 10 Pro, Nova 11, Nova 11 Pro, Pocket S, Mate 50e (Qualcomm platforms)
3. TYPICAL FAILURE MODES & SYMPTOMS:
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- Complete Dead Device (Zero Response to Power Key):
* Internal failure or dead short on the main VPH_PWR buck line inside PM7250B prevents system power
from reaching the Master PMIC (PM7250) and the AP.
- Fake / Slow Charging & Zero Current Ingestion:
* Handset shows charging animation on display, but drawing 0.00A or 0.10A on USB power meter;
battery percentage fails to increase or slowly drops during use.
- Overheating PM7250B with Instant Battery Drain:
* Phone becomes extremely hot in the lower/middle motherboard area even when turned off.
- USB Not Recognized / OTG Failure:
* Damaged CC logic or D+/D- internal diodes prevent communication with PC or detection of OTG flash drives.
- Display Black Screen (Missing Backlight or OLED Voltages):
* Handset powers on with vibration and sound, but screen shows no picture due to failed boost/bias circuit.
4. SYSTEMATIC DIAGNOSTIC PROCEDURE:
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A. Cold Testing (Diode Mode Check - Motherboard Powered Off):
1. Connect Multimeter RED probe to GND shield, use BLACK probe to measure:
- VBUS Input Filter Capacitors: Normal ~500mV – 650mV.
- VPH_PWR Inductor & Output Caps: Normal ~350mV – 480mV. If 0.000V, dead short is confirmed.
- Battery Positive Connector Pin (VBAT): Normal ~450mV – 550mV.
- USB Data Lines (D+ and D-): Normal ~600mV – 750mV (must be closely balanced within 20mV).
- CC1 & CC2 Pins: Normal ~600mV – 700mV.
2. Short-Circuit Isolation Rule:
- If VPH_PWR shows 0.000V, inject 3.8V DC (limited to 2.5A) directly onto the VPH_PWR line using
rosin smoke or thermal imaging. If PM7250B glows bright white, remove and replace the chip.
B. Live Voltage Check (Hot Testing):
1. Plug in 5V USB Type-C charger (without battery connected):
- Verify 5.0V on input filter capacitor next to PM7250B.
- Measure VPH_PWR main switching inductor: Must oscillate and output 3.8V – 4.2V DC steady.
- Check VBAT battery connector terminal: Must pulse periodically between 3.7V and 4.2V (battery detection).
2. If VBUS enters the IC at 5V, but VPH_PWR remains at 0V, replace PM7250B.
5. SOLDERING, REBALLING & REWORK SPECIFICATIONS:
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- Heat Shielding:
* Apply dual-layer thermal Kapton tape and heat-dissipating copper/aluminum foil over nearby CPU/eMMC/UFS.
- IC Removal:
* Apply high-grade BGA flux around the edges of PM7250B.
* Hot air station settings: 315°C – 325°C at 40% – 50% airflow.
* Circle nozzle evenly around the chip; lift cleanly with fine ESD tweezers once the balls melt.
- Pad Dressing:
* Remove residual lead-free solder using copper wick and iron at 300°C. Clean with 99% IPA.
- Reballing:
* Use dedicated Qualcomm PM7250B / SM7250 stencil (0.12mm thickness) with 183°C Sn63/Pb37 solder paste.
* Heat stencil at 290°C – 300°C until uniform solder spheres form.
- Alignment & Installation:
* Position Pin 1 mark matching the motherboard PCB corner silkscreen. Reflow at 310°C until the IC
naturally pulls into center alignment. Let board cool completely before connecting power.
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