P93205 IC
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P93205 / P9320S HIGH-EFFICIENCY WIRELESS CHARGING RECEIVER PMIC GUIDE
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1. PRODUCT IDENTIFICATION & HARDWARE SPECIFICATIONS:
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- Part Number: P93205 / P9320S (Silkscreen laser marking: P9320S / P9320S-0AHGI8)
- Base Product Family: IDT / Renesas P9320 Series Wireless Power Receivers
- Silicon Manufacturer: Renesas Electronics (formerly Integrated Device Technology - IDT)
- Function: Highly Integrated Wireless Power Receiver & Fast Wireless Charging PMIC
- Compliance Standards: WPC Qi Specification v1.2.4 & PMA Compatible
- Package Type: WLCSP (Wafer-Level Chip Scale Package) / Micro-BGA Array
- Operating Frequency Range: 110 kHz – 205 kHz
- AC Input (Coil Interface): AC magnetic induction from NFC/Wireless charging flex coil
- Output Voltage Range (VOUT): 5.0V (Standard Wireless Mode) up to 9.0V / 10.0V (Fast Wireless Mode)
- Maximum Output Power: 10W to 15W High-Efficiency Power Delivery
- Reballing Stencil: Amaoe Universal Samsung Wireless Charging / 0.12mm WLCSP Stencil
- Recommended Solder Paste: 183°C Leaded Solder Paste (Sn63/Pb37)
- Hot Air Rework Settings: 300°C – 320°C (Airflow: 35% – 45%)
2. CIRCUIT ARCHITECTURE & MOTHERBOARD ROLE:
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- Synchronous Rectification: Converts high-frequency alternating electromagnetic flux received
by the copper coil antenna into smooth, regulated DC voltage (VRECT).
- Bidirectional Communication: Modulates load impedance (ASK/FSK telemetry) to send identification,
power control packets, and temperature data back to the wireless transmitter pad.
- Dynamic Power Control: Interacts directly with the primary charging management IC (such as
MAX77705 / S2MU106) to negotiate fast wireless charging voltage (9V).
- Foreign Object Detection (FOD): Monitors parasitic power losses to prevent metal overheating.
- Compatible Handset Models:
* Samsung Galaxy S-Series: Galaxy S8, S8+, S9, S9+, S10, S10e, S10+, S20 FE, S21
* Samsung Galaxy Note-Series: Galaxy Note 8, Note 9, Note 10, Note 10+, Note 20 5G
* Select Qi-enabled flagship mobile devices.
3. COMMON MOTHERBOARD FAULT SYMPTOMS:
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- Wireless Charging Completely Inoperative: Wired USB cable charging works at normal speed,
but placing the phone on an active wireless charging pad produces zero response.
- Transmitter LED Flashing (Handshake Failure): The wireless charging pad detects the phone but
flashes an error light (blue/amber), indicating failed digital handshake packet exchange.
- "Wireless Charging Paused / Temperature Paused" Notification: Device displays false battery
temperature alerts during wireless charging due to broken thermistor feedback inside P9320S.
- Intermittent / Looping Wireless Charging: Charging connects for 2-3 seconds, disconnects,
and reconnects in a continuous loop.
- Secondary Power Leakage (0.04A - 0.10A): Damaged synchronous rectifier diodes cause current
drain from the main VPH rail to ground even when idle.
4. STEP-BY-STEP DIAGNOSTIC & TESTING PROCEDURES:
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A. Cold Testing (Multimeter Diode Mode):
1. Disconnect battery and remove wireless coil connector.
2. Set multimeter to Diode Mode.
3. Place RED probe on motherboard ground shield. Probe coil interface pads (AC1, AC2):
- Normal diode reading on AC1 / AC2: 520mV – 680mV.
- Both pins must have closely matched diode values (tolerance within ±15mV).
4. Measure the main rectified capacitor (VRECT rail):
- Normal reading: 450mV – 580mV.
- If VRECT reads 000mV (short circuit), P9320S is internally punctured.
B. Hot Testing (Live Charging Voltage Check):
1. Reconnect wireless coil and place phone on an operating wireless charging stand.
2. Measure DC voltage on VRECT bypass capacitor:
- Initial detection voltage: 5.0V – 5.5V.
- Upon successful fast charging negotiation: Rises to 9.0V DC.
3. Verify VOUT line feeding the main charging IC:
- If 9.0V is present on VRECT but VOUT is 0.0V, P9320S internal LDO/pass-FET is burned out.
5. REWORK, REBALLING & INSTALLATION GUIDELINES:
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- Thermal Precaution:
* P9320S has a fragile silicon glass top. Avoid metal tweezers contacting the die surface
directly with excessive force to prevent silicon cracking.
* Shield surrounding RF chips and flash memory with polyimide thermal tape.
- Chip Removal:
* Apply premium low-solid flux around the chip boundary.
* Heat with hot air at 305°C – 315°C with moderate airflow (35%).
* Nudge gently with tweezers; once molten, lift the chip vertically.
- Pad Preparation:
* Wick the motherboard pads flat using a chisel soldering tip (300°C) with solder braid.
* Clean thoroughly using 99% Isopropyl Alcohol (IPA) to eliminate burnt flux residue.
- Reballing & Alignment:
* Use a 0.12mm dedicated BGA stencil and 183°C solder paste.
* Form uniform solder spheres at 280°C.
* Apply a microscope-thin layer of flux to PCB pads.
* Align Pin 1 index dot precisely with PCB silkscreen marking.
* Apply hot air at 300°C until the chip centers automatically via surface tension.
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