Showing 685–696 of 886 results

RF4 RF-H2 1000W Fast smd Desoldering Hot Air Gun Soldering Station Digital Display

23,000
RF4 1000W FaFeatures: 3 running channels CH1, CH2, and CH3, each channel temperature, the air volume, and other parameters can

RF4 RF-H5 Digital Hot Air Gun

23,000
RF4 RF-H5 Digital Hot Air Gun RF4 RF-H5 Hot Air Gun Digital Display Intelligent BGA Rework Station Package includes: 1

RF4 RF-S110 Smart BGA Soldering Station

24,500
RF4 RF-S110 RF-S210 RF-S310 Smart BGA Soldering Station RF4 RF-S110 RF-S210 RF-S310 Features: 1. Temperature memory channel switching: CH1 channel

RF4 RF-S210 Smart BGA Soldering Station

18,500
RF4 RF-S110 RF-S210 RF-S310 Intelligent Temperature Control BGA Soldering Station for Mobile Phone/iPad/Tablet/Electronic Motherboard PCB CPU BGA SMD Chip Welding

RF4 RF6555 Pro Max 65X Trinocular Microscope With Aluminum Base

78,000
Specification: Magnification: Continuous zoom 6.5X to 55X Head: 45-degree inclined 360-degree swiveling trinocular Eyepiece: WF10X/22MM adjustable Objective: 0.65-5.5X Zoom Knob:

RF4 RF7050-TVW TRINOCULAR STEREO MICROSCOPE WITH DOUBLE ARM 360 DEGREE ANGLE BOOM STAND

104,000
RF4 RF7050-TVW TRINOCULAR STEREO MICROSCOPE WITH DOUBLE ARM 360 DEGREE ANGLE BOOM STAND Magnification 7X-50X zoom magnification power with crisp

RF4 WD165 0.7x Lens For Microscope

2,500
RF4 WD165 0.7x Lens For Microscope RF4 WD165 0.7X Auxiliary Microscope Lens for Trinocular Stereo Zoom Microscope

RL-068 MINI POLISH PEN

4,500
We supply all kinds of goods and equipments needed for mobilephone repairing at best price. polish pen mini rl-068

RL-601MA RELIFE CPU REBALLING TIN PLANTING PLATFORM WITH 58PCS STENCILS

13,800
RELIFE RL-601MA 58pcs CPU Reballing Stencil Platform Support Qualcomm, Snapdragon, Hisilicon Kirin, Exynos, BGA For Android CPU IC Chip Planting

RL-601MA RELIFE iPhone 6-16PM CPU Tining Tool set

6,000
iPhone CPU tin planting platform set suitable for A8/A9/A10/A11/A12/A13/A14/A15 CPU Automatic and precise alignment / Universal chip slot structure /