Description
KEY FEATURES
With Magnetic:No
Model Number:BGA Reballing Universal Stencil Template For Mobile phone
Pieces Included:1
Material:Other
Origin:Mainland China
Material:Steel mesh
Name:BGA Reballing Universal Stencil for mobile phone
Typle:Direct heating stencils
Color:gray
Apply to:For Mobile iphone motherboard BGA IC CPU Repair
WHAT’S IN THE BOX
1X New Model Universal BGA Reballing Stencil For Mobile Phone MTK MSM Samsung VIP80 Spreadtrum OV camera, iPad CPU RAM PM Power IC
SPECIFICATIONS
SKU: GE779EA4G9XRSNAFAMZ
Model: BORshoujiweixiu2762
Production Country: China
Size (L x W x H cm): 10x8x6
Weight (kg): 0.2
Color: Stencil 1
Main Material: PVC
New Model Universal BGA Reballing Stencil For Mobile Phone MTK MSM Samsung VIP80 Spreadtrum OV camera, iPad CPU RAM PM Power IC Direct Heat Template
1. 55 Models New Universal Stencils2. 80 Models Stencil Suitable For VIP80 (New) ,Spreadtrum, OV camera, IC, MTK Series3. Precision mobile phone Universal Stencils (New)4. 0.3-1.24 Universal Stencil
Description:
100% and high quality.Feature:These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.High succe rate of planting tin, the solder balls can be formed once when you are proficient.Simple and convenient to use
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