MT6769V IC
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Product Details
Product Details:
- Part Number: MT6769V (Variants: MT6769V/CZ, MT6769V/CT, MT6769V/CU, MT6769V/CB)
- Commercial Names: MediaTek Helio G80 / Helio G85 / Helio G70
- Manufacturer: MediaTek Inc. (MTK)
- Semiconductor Process: 12nm FinFET Technology (TSMC)
- Core Architecture (Octa-Core 64-bit):
* 2x High-Performance ARM Cortex-A75 cores running up to 2.0 GHz
* 6x High-Efficiency ARM Cortex-A55 cores running up to 1.8 GHz
- Graphics Processing Unit (GPU): ARM Mali-G52 MC2 (2EEMC2) @ 820 MHz (G80) / 950 MHz (G85)
- Memory & Storage Support:
* RAM: Dual-channel LPDDR4X up to 1800 MHz (typically up to 8GB)
* Storage: eMMC 5.1 interface
- Typical Companion IC Ecosystem:
* Primary Master PMIC: MT6358W
* Sub-PMIC / Charger IC: MT6371P / RT9471 / SGM41511
* RF Transceiver: MT6177W
- Package Type: BGA (Ball Grid Array)
- Stencil Compatibility: Amaoe MT6769 / Amaoe MT-CPU Middle Stencil (0.12mm)
- Recommended Reballing Paste: 183°C Leaded Solder Paste (Mechanic / Relife)
Usage:
- Central Processing Unit:
* Drives complete smartphone operation, handling application logic, display rendering, camera ISP pipelines, and cellular baseband communications.
- Compatible Smartphone Models:
* Xiaomi / Redmi / POCO: Redmi 9 (Lancelot), Redmi 9 Prime, Redmi Note 9 (Merlin), POCO M2
* Realme: Realme 6i, Realme C25, Realme Narzo 20, Realme Narzo 30A
* Samsung: Galaxy A22 4G (SM-A225F), Galaxy A32 4G (SM-A325F), Galaxy M22, Galaxy M32
* Infinix & Tecno: Infinix Note 7, Note 8, Hot 10S; Tecno Camon 16, Camon 17, Pova
* Vivo: Vivo Y20G, Vivo Y33s
- Common Motherboard Fault Signatures & Repair Diagnostics:
* Hang on Logo / Bootloop:
- Extremely common on Redmi 9 / Note 9 and Infinix devices. Thermal stress causes solder balls underneath Cortex-A75 cores to crack, leading to reboots during high-load Android boot animation. Resolved by lifting, cleaning, and reballing MT6769V.
* Dead Handset (Stuck at 0.06A - 0.15A on DC Power Supply):
- Handset fails to power on. Pressing the power key registers low fixed current consumption without proceeding to kernel initialization.
* MediaTek USB Port (COM Port) Detection Only:
- Connecting the phone to a PC with no battery or test-point registers "MediaTek USB Port (COMXX)" without screen display, indicating CPU boot ROM is responding but memory (RAM/eMMC) communication is broken.
* Thermal Cracking from Physical Impact:
- Device experiences sudden loss of Wi-Fi, audio, or cameras after a drop due to fractured trace connections between the CPU and peripheral bus controllers.
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