Description
MECHANIC UV-559 BGA Lead-free Solder Paste for BGA CPU SMD Rework Repair
MECHANIC UV-559 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball.
With Three Nozzles
Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals
MECHANIC UV-559 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball.
With Three Nozzles
Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals
Specifications of MECHANIC UV-559 BGA Lead-free Solder Paste for BGA CPU SMD Rework Repair
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