JTX T4 Universal Chips Glue Removal Platform Set with 3D stencils supported 76 models for Iphone Samsung EMMC RAM

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Description

JTX T4 Universal Chips Glue Removal Platform Set with 3D stencils supported 76 models for Iphone Samsung EMMC RAM

T4 degumming and tin planting platform, support Apple/Huawei /OPPO/vivo/Honor/Xiaomi/Samsung and other models a total of 76 models of chips

The 2-in-1 design greatly helps the maintenance master to save costs and plant tin efficiency

Magnetic automatic clamping, universal 3D planting tin net, removing the glue card, precise positioning

Clamping precision, more stable operation, not easy to damage the chip

Using a new type of magnetic dynamic positioning, strong magnetic clamping stable, automatic alignment

It has wear-resistant, anti-slip, shock-absorbing, anti-aging, non-toxic tasteless and high-temperature resistance

Selected high-quality steel, fine workmanship, wear resistance, high toughness support tin planting

Support unlimited expansion, a total of 76 types of chips

Supported models are as follows:

Qualcomm: MSM8909/8905, MSM8916/8939, MSM8917, MSM8953, MSM8953 1AB, MSM8937/8940, MSM8996, SM8150, SM8250, SM8250-002, SM8350, SM8450, SM8475, SM8550, SM8650, SM6115, SM7225-00AB, SM7250, SM7325, SM7350, SDM439, SDM636, SDM710, SDM845

Dimensity: MT6761V/6762V/6765V, MT6885Z, MT6895Z, MT6893Z, MT6855V, MT6853V, MT6877V, MT6769V, MT6873V, MT6833V, 1100/1200, 9200, 9300

Android RAM: BGA 376, BGA 436, BGA 496, BGA 556

Samsung Exynos: 990, 8895, 980, 2100, 2200, 9820

Huawei Hisilicon: HI3660, HI9290/L, HI6280, HI3690 5G, HI3680, HI36A0, HI3670, HI36A0, HI6260, HI3690 4G

Apple: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17

Package includes:

1 x Fixture

13 x Stencil

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