Name: RL-601MA RELIFE CPU REBALLING TIN PLANTING PLATFORM WITH 58PCS STENCILS
SKU: 10632
Price: 13800 PKR
Availability: InStock

RL-601MA RELIFE CPU REBALLING TIN PLANTING PLATFORM WITH 58PCS STENCILS

13,800₨

Description

RELIFE RL-601MA 58pcs CPU Reballing Stencil Platform Support Qualcomm, Snapdragon, Hisilicon Kirin, Exynos, BGA For Android CPU IC Chip Planting Tin Template Fixture. CPU List RELIFE RL-044 SMC11 MSM8996 0.12MM RELIFE RL-044 SMC12 MSM8953 IAB 0.12MM RELIFE RL-044 SMC13 MSM8953 0.12MM RELIFE RL-044 SMC14 SDM636/660 0.12MM RELIFE RL-044 SMC15 MSM8909/8905 0.12MM RELIFE RL-044 SMC16 SM61150.12MM RELIFE RL-044 SMC17 MSM8916/8939 0.12MM RELIFE RL-044 SMC18 MSM8937/8940 0.12MM RELIFE RL-044 SMC19 MSM8917 0.12MM RELIFE RL-044 SMC20888+ 0.12MM RELIFE RL-044 SMC21 Gen2 0.12MM RELIFE RL-044 MTC7 MT6769V 0.12MM RELIFE RL-044 MTC8 MT6762V 0.12MM RELIFE RL-044 MTC9 MT6582 0.12MM RELIFE RL-044 MTC101100/12000.12MM RELIFE RL-044 MTC11 9200 0.12MM RELIFE RL-044 EXC1 Exynos2200 0.12MM RELIFE RL-044 EXC2 Exynos9820 0.12MM RELIFE RL-044 EXC3 Exynos990 0.12MM RELIFE RL-044 EXC4 Exynos9815/1080 0.12MM RELIFE RL-044 EXC5 Exynos980 0.12MM RELIFE RL-044 EXC6 Exynos2100 0.12MM RELIFE RL-044 EXC6 Exynos8895 0.12MM RELIFE RL-044 SMC1 888/SM8350 0.12MM RELIFE RL-044 SMC2 845/SMD845 0.12MM RELIFE RL-044 SMC3 765G/SM72500.12MM RELIFE RL-044 SMC4855/SM8150 0.12MM RELIFE RL-044 SMC5 865/SM8250-002 /w`2uy70.12MM RELIFE RL-044 SMC6 865小/SM8250 /0.12MM RELIFE RL-044 SMC7 8Gen1/SM8450 /0.12MM RELIFE RL-044 SMC8 888/SM8350 0.12MM RELIFE RL-044 SMC9 780/775/SM7350 0.12MM RELIFE RL-044 SMC10 778G/SM7325 0.12MM RELIFE RL-044 MTC1 810/MT6833V 0.12MM RELIFE RL-044 MTC2 720/MT6853V 0.12MM RELIFE RL-044 MTC3 800/MT6873V 0.12MM

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