MECHANIC UV-559 BGA Lead-free Solder Paste for BGA CPU SMD Rework Repair
MECHANIC UV-559 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball.
With Three Nozzles
Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals
MECHANIC UV-559 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball.
With Three Nozzles
Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals
Specifications of MECHANIC UV-559 BGA Lead-free Solder Paste for BGA CPU SMD Rework Repair
“relife soldering wick RL 1520” has been added to your cart. View cart
“relife soldering wick RL 1520” has been added to your cart. View cart
MECHANIC UV-559 BGA Lead-free Solder Paste for BGA CPU SMD Rework Repair
400₨
Categories: All Products, MECHANIC, tools
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