Description
MECHANIC XG-Z40 SPECIAL SOLDER/REBALLING PASTE (183℃)
The BGA Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips.
Alloy: Sn637PB37,
Microns: 25-45 um
Volume: 10cc
High-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.
Soldering paste for cell phone PCB and SMD etc.
Help to repair the circuit boards and protect the electronic components
A necessary material for repairing the mobile phone mainboard
Solder Paste – no clean soldering
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