Showing 37–48 of 69 results

PM-3 stencil

 800
Product details of Amaoe Stencil for PM3 PM845 PM660D PM489 BGA Reballing Stencil Power IC Amaoe PM3 PM845 PM660D PM489

RELIFE RL-044 BGA Reballing Stencil Kit Thickness Tin Mesh Solder Template For IPhone 6 6S 7 8 X XS XR 1112 13 14/Pro/Max 15 (10 pieces set)

 5,500
rl 044 precision bga stencils10 in 1 set RELIFE RL-044 BGA Reballing Stencil Kit Thickness Tin Mesh Solder Template For

Relife RL-601T 22 In 1 Middle Layer Reballing Platform For iPhone X-15 Series

 15,000
Designed for IPX-15PM mid-tier motherboard repair, this solution offers: Built-in Three High-Temperature Strong Magnets: Featuring strong magnetic adsorption, precise positioning,

RL-601MA RELIFE CPU REBALLING TIN PLANTING PLATFORM WITH 58PCS STENCILS

 16,500
RELIFE RL-601MA 58pcs CPU Reballing Stencil Platform Support Qualcomm, Snapdragon, Hisilicon Kirin, Exynos, BGA For Android CPU IC Chip Planting

S20 stencil

 1,500
Amaoe BGA Reballing Stencil for Samsung S20 G988B/BR Motherboard Soldering Tin planting platform phone repair tools Amaoe BGA Reballing Stencil

S21 SM-G991U/0/W/D-S AMAOE STENCIL

 1,000
Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder

S21 stencil

 1,500
AMAOE Samsung S21 Ultra Middle Layer Reballing Stencil Template For Samsung S21 Ultra SM-G988U G988W G9880 G988D

S21+ stencil amaoe

 1,500
AMAOE S21+ SM-G996U/O/D/W MIDDLE LAYER STENCIL