Showing 1–12 of 70 results

18 IN 1 BGA Reballing Stencil kit For iPhone X-14 Plus/14 Pro Max Motherboard Middle Layer Planting Tin Plate With Fixing Base

 16,500
Details Customized No Size 0.12mm Packaging BOX Model Number BGA reballing stencil kit for iphone Application Computer Toolkit DIY Supplies

AKT AMAOE QU-7 STENCIL For QUALCOMM CPU SM4250,SM6125,SM6115,SM7125,SM7150 SM7225,SM7250,SM7350 CPU IC Chip Reballing Soldering Tin Plant Net Stencil (Pack of 1, 1 Square)

 800
AKT AMAOE QU-7 STENCIL For QUALCOMM CPU SM4250,SM6125,SM6115,SM7125,SM7150 SM7225,SM7250,SM7350 CPU IC Chip Reballing Soldering Tin Plant Net Stencil (Pack of

Amaoe BGA Reballing Stencil For iPhone XS/XS Max/XR A12 CPU RAM IC Tin Planting

 800
Amaoe BGA Reballing Stencil For iPhone XS/XS Max/XR A12 CPU RAM IC Tin Planting Material : High quality steel.Strong Magnetic

AMAOE BGA REBALLING STENCIL PLATFORM FOR HUAWEI P30PRO MOTHERBOARD MID-LEVEL POSITIONING TIN PLANTING PLATFORM

 1,500
AMAOE BGA REBALLING STENCIL PLATFORM FOR HUAWEI P30PRO MOTHERBOARD MID-LEVEL POSITIONING TIN PLANTING PLATFORM,, mobile Screen (LCD or OLED), Battery,

Amaoe MI10 Stencil

 800
Amaoe MI10 Stencil Amaoe MI10 0.12MM BGA Stencil IC Solder Reballing Tin Net for Redmi K20 / K20 Pro /

AMAOE MQ 2 STENCIL FOR BGA IC REBALLING

 800
MQ2 MSM8909W/MT6761V/MT6779V/MT6758V/SDM439/MT6765V/6768V MTK CPU

Amaoe MU 3 BGA Reballing Stencil for MTK CPU

 800
Amaoe MU 3 BGA Reballing Stencil for MTK CPU MT6739V MT6762V MT6771V MT6763V MT6757 Origin: CN(Origin) Material: Stainless steel Brand

AMAOE QU-8 Stencil for SM8520-102, SM8520-002, SDM439, SM8250-102 RAM, QUALCOMM Series CPU IC BGA REWORK REBALLING Stencil 0.12MM

 800
AMAOE QU-8 Stencil for SM8520-102, SM8520-002, SDM439, SM8250-102 RAM, QUALCOMM Series CPU IC BGA REWORK REBALLING Stencil 0.12MM

AMAOE QU3 CPU Stencil Qualcomm

 800
AMAOE QU3 CPU Stencil Qualcomm Origin: CN(Origin) Model Number: For MSM7225A MSM8928 MSM8940 MSM8937 SDM660 MSM8612 Material: Alloy Steel Usage: